Partial Wafer Correlation

This is similar to the Full Wafer Correlation & Analysis Report, but takes into account that the wafer can be probed at any point. Because correlation wafers or die can only be probed a certain number of times before probe marks on the probe pads become an issue, operators are limited to only probe portions of the wafer. These partial probe results are then compared with the baseline data to see if the data correlates. This report extends the life of a correlation wafer, as well as cuts down on test time when performing correlation runs.