Product engineers verify chip design robustness and document the variance of important electrical measurements for a new IC or process through device characterization. Characterization analysis screens for problems to ensure adequate yield for target specifications. Primarily performed on “split lots” device characterization results are summarized in a characterization report that includes Cpk (process capability index), yield forecast data, and correlation analysis between operations (e.g., Probe vs. Final Test). yieldWerx Enterprise includes the distribution and correlation analytics needed to accurately and efficiently characterize devices and generate characterization reports.