Metrology and Defect Data Management

Synopsis:

Ability to manage Metrology/Defect data, perform defect classification, defect carry-over analysis, and correlate defect data with test data.

 

Description:

Improving yield in a wafer fab facility relies on metrology data and defect data by defect data management module. Metrology data provides parametric information about linewidths of metal lines, transistor critical features, and even IC-created resistors, capacitors, and inductors.  These can be taken on the PCMs found in scribe lines or on dedicated die in the wafer whose sole purpose is silicon process feedback. Such data can be used by product and quality engineers to provide feedback to their fab partners when it is cross-correlated with test data.

 Assessing particles and their impact on wafer processing remains a key process indicator for quality and fab engineers to monitor for process excursions.  Driving down defectivity rates directly correlates to both yield improvement and reduction of escapes- measured in parts per million. The classic defect size chart that relates to semiconductor processes critical dimensions changes per layer and per-process node.  Yet it maintains a classic shape that is valid for most silicon process nodes.

The Defect Data management module enables companies to manage the data, perform defect classification from images available from inspection equipment and build the pareto of defect sizes per layer.  It enables cross-correlation with the results of wafer probe data and the resulting wafer maps.  The ability to connect die level data all the way through final test is possible as long as the associated product has unique ids.

Where applied:

  • Wafer probe
  • Final test

Engineering Roles Impacted:

 

Dependencies on other modules:

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