Our customizable product suite consists of 10 modules, some with their individual sub-modules, providing the ultimate flexible and scalable data analytics solution.
Holistic end-to-end data visualizations and insight
Advanced Product customizations for wafer, reticle, and die
Management of the metrology, critical dimension, images, and defect data
Robust outlier detection algorithms including PAT++, Zonal Pat, Nearest neighbor residual
Ink and inkless wafer and reticle mapping allowing full control and seamless integration
Real-time or passive data collection from equipment
Merges and redefines unique wafer and data sets, automating the merging process
Proactive real-time lot and wafer/screen management equipped with advanced AI
IP and Test parameter traceability that can track IP blocks and their specifications
Stringent test program release controls with version control of test program files
Aggregates data across product manufacturing lifecycle
Simple drag and drop features
Extensive modeling and real-time analytics
Automatically set alerts and share reports
Allows for unique wafer probing edge and sequence definitions for characteristics, reticle, and device
Associates custom data to any data source and used in conjunction with realtime reports
Optimizes probing and inspection sequence/pattersns i.e. CCA
Maximize yield and attain zero defect certification
Dynamic and Static (SPAT and DPAT), Good Die in Bad Neighborhood (GDBN), GDBN-Z, Multivariant PAT, Non-Gaussian Data Distribution detection
Supports both ZPAT and NNR
Statistical process control (SPC), Statistical Bin Limit (SBL), Statistical Yield Limit (SYL)
Allows seamless application of unique policies and chracteristics to aggregated data
Enables comprehensive what-if analysis and generation of detailed assembly maps
Incorporate custom test points and defect information such as differing temperatures into aggregated data sets to predict issues before they occur
Real-time or passive data collection from equipment supporting parameter monitoring, DUT and generates adaptive probe wafer maps to minimize retest and touchdowns
Immediate insight into machine performance allows machine operators to quickly address downtimes and inefficiencies, reducing unnecessary downtimes and increasing throughput
Streamline Return Material Authorizations (RMA) for users utilizing Lot Genealogy alongside AI and ML learning for commonality analysis to identify undetected escapes and ascertain the impact on other lots
Using AI and ML learning, this module combines data from across the product test supply chain to forecast potential yield loss while guiding root cause analysis efforts
Automatically generate inkless assembly maps between prober and wafer test sites
Collection and analysis of serialized system and board data for traceability to packaged die across product lifecycle
Allows manual scrap or downgrade of die as well as pick die from wafer rather than complete wafer
Combnies test results from wafers, packaged die, and system boards for holistic view
Management of Critical Dimension (CD), Images and Defect Data
Facilitates rapid and previse root cause identification by linking defects to wafer probes, bin, sort, bitmap, parametric, and final test data
Efficiently identifies root causes and low yield causes
Enables analysis of significantly more and larger data sets quickly with assistance from AI/ML
In depth cross center correlation assisted by AI/ML algorithms through geospatial pattern recognition analysis of ANOVA
AI/ML knowledge graphs visually guide user down weighted paths to identify root causes
Provides Lot, Wafer, and Die level traceability from manufacturing to sort and final assembly
Tracks IP blocks to their specifications
Maintains consistent adherence to IP specs throughout manufacturing to ensure final product quality
Enables closed-loop processes for design to product yield enhancements and test time reduction (TTR)
Manages development and release of test programs, version control as well as files, vectors, and pattern files
Tracks engineering, qualification, and production releases to the relevant directories
Checks sums and enables release/push out releases internally as well as externally
