yieldWerx features a visual interface that enables image-guided correlation analysis, facilitating rapid and precise root cause identification by linking defects with wafer probes, bin sort, bitmap, parametric, and final test data throughout the manufacturing lifecycle. In combination with Bitmap/Optical and Pixel Map analysis, yieldWerx efficiently identifies the root causes of defects and low yield issues. The data can be classified as Defect or Unclassified. yieldWerx supports the linkage of defect images as well. Engineers can generate overlays for killer defects, carry-over analysis, defects by zone, and see the impact on probe yields. Furthermore, yieldWerx’s AI/ML modules can be trained to look for other anomalies and systematic defects that may not be easily detectable visually or otherwise. Data types supported include the typical KLARF or its equivalent in other formats.
