Bright Horizons in Silicon Photonics
From futuristic VR goggles and the glow of red light facial therapy, to the laser-sharp vision of self-driving cars, and the blazing intelligence of AI, these cutting-edge innovations all share…
5 Strategic Shifts to Capture Shares in the $1 Trillion Global Chip Market
The semiconductor industry surged through 2024 with impressive momentum, posting 19% year-over-year growth and reaching US$627 billion in global sales, surpassing earlier forecasts. Looking ahead, 2025 is projected to deliver…
Chiplets: The Building Blocks of Sustainability
Leading semiconductor companies are increasingly adopting circularity principles to extend the lifecycle of their products. These strategies aim to divert materials from final disposal through recycling, repair, resale, or reuse….
The Complete Guide to Wafer Defect Detection Using Knowledge Graphs in 2025
What do Google search, Facebookâs recommendations and modern wafer defect detection have in common? They all rely on knowledge graphs (KGs) to process intricately complex, interlinked data. What are Knowledge…
AI-Powered PAT: A New Era of Smarter Manufacturing
For the past three decades, the Automotive Electronics Council (AEC) has utilized Part Average Testing (PAT) as the standard for statistical screening. However, technological advancements beyond Moore’s Law have outpaced…
KLARF File Format: Enhancing Semiconductor Yield Analysis with yieldWerx
Understanding the KLARF File Format In the semiconductor industry, a KLARF file (KLA-Tencor Advanced Results File) is a specialised file format used to store data collected from semiconductor wafer inspection…
The 2022 CHIPS Act May Be Repealed: What Does This Mean for You?
The CHIPS and Science Act 2022 was passed with bipartisan support under the Biden administration to strengthen semiconductor manufacturing in the United States and reduce reliance on foreign supply chains…
End-to-end Semiconductor Data Analytics and Traceability Solutions For Multi-Chip Packages
Efficient test data integration is crucial for producing reliable multi-chip packages (MCPs. However, fabless companies, IDMs and OSATs face significant challenges in handling diverse test data formats associated with individual…
Semiconductor Traceability Using Lot Genealogy For Multi-Chip Modules
Multi-chip modules involve intricate workflows where devices traverse multiple stages, interact with other components, and integrate into sophisticated packages. However, this complexity brings significant challenges when it comes to lot…
How to Deal with the Challenges of MEMS Test Data Management and Yield Analysis
MEMS (MicroElectroMechanical Systems) are marvels of modern engineering. They blend mechanical and electrical components to enable advanced technologies like LiDAR, medical imaging, accelerometers, microphones, and pressure sensors. While their design…
Golden Eye: Enhancing Semiconductor Yield with Automated Optical Inspection Data
Automated optical inspection (AOI) is a powerful quality improvement tool for screening out dies with any visual defect. It uses high-speed cameras, special lights, and smart software to analyze pictures…
Ultimate Guide to Outlier Detection Using Part Average Testing
What is Part Average Testing PAT? Hidden reliability issues in ICs often remain undetected during production, only to appear once the chip is in use, potentially leading to costly system…