Cross-operation Correlation
by
YieldWerx
Test Engineering
Because product costs are added with every step in the semiconductor supply chain, eliminating low-yielding material early in the manufacturing process optimizes overall costs. yieldWerx Enterprise can correlate Final Test yields to Wafer Probe yields to eliminate bad material at probe, leading to package, assembly and test cost savings.
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Tags
ATDF
Automated Reports
Automated Testing System
big data analytics
Big Data Systems
Characterization
Chip Production
Contractual Data Archival
CSV
Design of Experiments (DOE)
Fabless Companies
Fabrication
Final Test
GDBN
Genealogy Analytics
Outliers
Parametric
Part Average Test (PAT)
Prob Testing
Process Capability Index (CPK)
Real-time Tracking of Yield Issues
Rectify Yield Issues
Root Causes of Yield Losses
Semiconductor Data Requirements
Semiconductor Manufacturing Process
Semiconductor Production
semiconductor testing
Semiconductor wafer manufacturing
Semiconductor Yield Managment
Semiconductor Yield Strategy
Six Sigma
SPC Analysis
SPC Monitoring
SPC semiconductor
wafer handling
wafer tools
Yield Engineering
yield enhancement
Yield Reporting
Yield Tracking Systems
yieldWerx Enterprise Modules
yieldWerx Enterprise Software
YMS
YMS Solution Components
Zero Defect Tools