Commonality Analysis, Equipment Commonality
Commonality Analysis refers to a set of techniques used to identify systematic causes of yield loss. Because of the complexity and number of process steps involved in semiconductor manufacturing, pinpointing…
Device Characterization and Correlation
Product engineers verify chip design robustness and document the variance of important electrical measurements for a new IC or process through device characterization. Characterization analysis screens for problems to ensure…
Gauge R&R ANOVA
Gauge R&R studies are critical to identifying unknown issues in measurement quality, and ANOVA is the preferred method for analyzing Gauge R& R results. ANOVA calculations are both highly detailed…
SmartLogic Data Cleansing and Mapping
One of the most challenging aspects of yield management is ensuring that data is consistent and accurate. Sifting through large volumes of data is a time-consuming task for engineers. yieldWerx…
Final Test to Probe Correlation
Because product costs are added with every step in the semiconductor supply chain, eliminating low-yielding material early in the manufacturing process optimizes overall costs. yieldWerx Enterprise can correlate Final Test…
Zonal vs. Average Process Control Monitor (PCM)
As standard wafer sizes have grown, the variation in electrical performance across a wafer has increased. Averaging the electrical results from a typical five-site Process Control Monitor (PCM) has become…
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