Device Characterization and Correlation
by
YieldWerx
Product Engineering
Product engineers verify chip design robustness and document the variance of important electrical measurements for a new IC or process through device characterization. Characterization analysis screens for problems to ensure adequate yield for target specifications. Primarily performed on “split lots,” device characterization results are summarized in a characterization report that includes Cpk (process capability index), yield forecast data, and correlation analysis.
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Tags
ATDF
Automated Reports
Automated Testing System
big data analytics
Big Data Systems
Characterization
Chip Production
Contractual Data Archival
CSV
Design of Experiments (DOE)
Fabless Companies
Fabrication
Final Test
GDBN
Genealogy Analytics
Outliers
Parametric
Part Average Test (PAT)
Prob Testing
Process Capability Index (CPK)
Real-time Tracking of Yield Issues
Rectify Yield Issues
Root Causes of Yield Losses
Semiconductor Data Requirements
Semiconductor Manufacturing Process
Semiconductor Production
semiconductor testing
Semiconductor wafer manufacturing
Semiconductor Yield Managment
Semiconductor Yield Strategy
Six Sigma
SPC Analysis
SPC Monitoring
SPC semiconductor
wafer handling
wafer tools
Yield Engineering
yield enhancement
Yield Reporting
Yield Tracking Systems
yieldWerx Enterprise Modules
yieldWerx Enterprise Software
YMS
YMS Solution Components
Zero Defect Tools