Synopsis:
Attach or link external files associate with wafer or lot level test results for subsequent consultation by an operator or engineer and interaction with other manufacturing tools.
Description:
There exists a wealth of data generated all along the semiconductor manufacturing process. This module exists to enable engineers to create interactive decisions between test data and non-test data sources. In addition, at their discretion engineers or operators can attach external data files to wafer or final test results. Having this data reside in the yieldWerx repository eliminates the need to create yet another SharePoint, wiki, or network drive.
IT admins can manage one data repository as opposed to tens of data sources scattered throughout the manufacturing facility and manufacturing supply chain.
Decisions during the manufacturing process do not rest solely upon electronic test data collected. Consider an inspection tool after wafer test has been performed. Engineers can reduce the cycle time of wafer inspection by using the pass/fail wafer map information. Suppose only 90 of the 553 die on that wafer are good- there’s no sense inspecting the 463 failed die. The converse occurs; the inspection tool may find a scratch or discoloration mark that impacts 20% of the die. According to the operational rules these die are marked as failures even if they passed the wafer electrical test. This new data changes the resulting assembly generation map. Similar scenarios can be found during the assembly and final test manufacturing steps.
Where applied:
- Wafer test
- Assembly
- Final test