Synopsis:
This module quickly identifies the lots, wafers, and other variables common to a failed device for rapid assessment of exposure risk. Reduce future escapes with data to drive the process or test improvements.
Description:
To support the full product lifecycle the RMA module provides quality and product engineers the analysis tools to respond to customer return devices. This could be a lines down situation at the end customer’s factory. In these situations, the pressure to identify similar devices remains high. You need to assure the customer that the exposure risk will be promptly determined and that actions for containment will be planned. An unusually high excursion/failure rate at a later test step requires similar capabilities. No one wants to waste manufacturing resources testing poorly made products.
Core yieldWerx modules have already established the data integrity, access, and storage to support engineers in making these assessments because the data can be trusted. With the RMA module engineers identify the returned material attributes (e.g., lot number, wafer position, ATE equipment) Next the module supports engineers in identifying all the devices with this same genealogy and determining where these devices currently reside. The resulting analysis permits a rapid assessment of exposure risk and directs the actions for a subsequent containment plan. This can inform recall of devices in the field to reduce customer liability- an immediate concern for safety for critical applications (e.g., medical devices and automotive systems). The ability to provide a list of devices with their set of unique identifiers is a must-have in these situations. For a high fallout at a subsequent test step, the containment plan would include putting holds on all material in the manufacturing pipeline that has not reached that step. Then engineers would perform a commonality analysis and engineering experiments
Where applied:
- Wafer Probe
- Final Test
- OSAT
- System Test