Synopsis:
Ability to automatically control the prober. Collect real-time test data and make decisions that change the probing pattern.
Description:
Customers optimizing throughput of expensive test and prober equipment benefit from using the real-time prober control module. With the real-time prober control module, engineers can connect test program results, graphical wafer maps, operator command, or data analytics to control the wafer probing process and the corresponding data collection process. Engineers can reduce test times sample testing on a wafer and based upon results decide if the wafer can have remaining die marked pass or shift to full probe.
When combined with either the statistical process control module or the reporting and analysis module, engineers can make decisions based upon real-time data to manage a yield excursion. They can skip testing a die based upon x-y location on a wafer because they have the historical data from a stacked wafer map that this die fails 99% of the time. The level of refinement in response can be quite powerful in terms of responding in an intelligent manner to real-time data. Consider a multi-site probe card, engineers can automatically re-probe and re-test a die based upon a failure of opens test such that a different set of probes are used. Thereby responding to a possible bad probe site in such a manner that wafer test can be completed before stopping the rest of the wafer testing.
Engineering Roles Impacted:
Dependencies on other modules:
- Smart Wafer Merge
- Custom Test Limits
- Statistical Process Control
- Reporting Analysis Module.