Synopsis:
Ability to associate die with probe site, reticle site, and WAT/PCM sites. Enables communication with Wafer prober for both test and inking functions.
Description:
Associating a wafer map pre-test such that die location is associated with probe, reticle, and WAT/PCM sites has multiple benefits to wafer test and handling operations. A few representative applications are described below.
Without this capability, a wafer test may unnecessarily test the same die twice. This wastes test time and it also impacts metrics like the number of touchdowns per die. For automotive applications, a rule of only 4 touchdowns per die can be easily violated when you have three temperature testing.
A wafer may have multiple products on a wafer due to a 4 product mask reticle. This module assists engineer in planning the test program interaction as the prober touches down on unique die.
Wafer-level mapping data can be used to drive the probing and inking sequence in which knowing the WAT/PCM die can be skipped as well as the partial/edge die.
Where applied:
- Wafer Test
- Wafer Prober
- Assembly Map Generation
Engineering Roles Impacted:
- Product Engineer
- Process Engineer
- Test Equipment Engineer
Dependencies on other yWModules:
Core yieldWerx 2.0